Cluster-type sputtering device for panels CLUSTERLINE 310
Cluster-type sputtering device for panel-level packaging compatible with panels up to 310×310mm.
The "CLUSTERLINE 310" is a dedicated platform that leverages expertise in processing 300mm wafers and large panels, supporting panel processing of up to 310×310mm. It adopts a cluster architecture equipped with cassette-to-cassette processing and fully automated substrate transport. This is a small panel solution for panel-level packaging, such as for AI chiplets. The first unit was shipped in October 2026. *For more details, please feel free to contact us.*
- Company：Evatec Japan Ltd.
- Price：Other
